Job Overview
Founded in 1991, Silicon Microstructures, Inc. (SMI) is a world leader in the design and manufacture of Micro Electro-Mechanical Systems (“MEMS”) that lie at the heart of the advanced sensing market, enabling devices in the medical, industrial, digital consumer, security, and automotive sectors.
The company has established itself as a premier provider of MEMS-based pressure sensors for a range of markets, supplying advanced high and low-pressure sensor products that meet the stringent requirements for industry and consumer safety. Silicon Microstructures’ design, production and quality control processes have enabled it to develop both the smallest and smartest pressure sensors available today. SMI offers a wide range of pressure sensors, including uncompensated sensors, temperature compensated and calibrated products as well as sensor systems consisting of an ASIC paired with a sensor die in a custom package.
In 2019 SMI was acquired by TE Connectivity and is now part of the TE Sensor Solutions (TESS) business units.
The Position as Dry Etch Process / Product Engineer contains the responsibilities to develop, implement, maintain and document methods, operation and processes in the manufacture or fabrication of MEMS devices using the DRIE process. The Process/ Manufacturing Engineer will work closely together with the production and R&D team. He/she will be responsible for running process evaluation lots and to disposition non-conforming material on the production floor and drive process/test improvement to increase product yield. He / she will also be responsible for yield optimization, process improvement, customer communication and related documentation of an assigned pressure sensor product line. The position requires spending 75% of the time in the cleanroom.
What your background should look like:
ESSENTIAL FUNCTIONS
- Provide support and own the dry etch processing across all dry etch (DRIE) machines. Maintaining and optimizing specific product
- recipes and required SPC data.
- Responsibility and ownership of the processes, documentation and engineering of assigned production module to ensure that all
- released production processes and equipment are compliant with quality requirements
- Responsibility for an assigned product line including documentation of PFMEA, Control Plan and technical customer support. Drive
- improvement of quality and manufacturing costs.
- Documentation of production processes, process changes and results of DOE type work
- Support production by evaluating problem lots, monitoring yield and by defining corrective actions to improve production processes
- Optimize and sustain existing production processes with CIPs (Continuous Improvement Programs) and by using statistical methods
- to monitor key process parameters.
- Develop new processes as required by device design and parameters
- Qualification of new production equipment and engineering support of existing equipment
- Disposition of non-conforming material, use of problem solving techniques and support failure analysis
- Lead and participate in identified yield improvement activities by using standard tools such as 5 Why, Ishikawa diagrams, 8D’s and similar problem solving tools.
EDUCATION, SKILLS AND EXPERIENCE REQUIRED
- A BS/ MS degree in Electrical / Mechanical/ Chemical Engineering is required
- 5-10 Years of experience in Semiconductor/ MEMS device fabrication is required, preferably in a DRIE role.
- Hands on wafer processing experience in cleanroom environment is required
- Experienced with standard metrology equipment used in semiconductor/ MEMS fabrication
- Ability to work with proper PPE, and chemicals used in semiconductor manufacturing process
- Experience with formal release of process, product, and procedures
- Knowledge of DOE, ANOVA, and SPC in production environment
- Ability to draft, publish and present test results and conclusions in internal / external reports
- Excellent communication and interpersonal skills
- Knowledge of MS Office (Excel, Word, Access, Power point), Visual Basic, LabView
- Self-Starter, self-motivated, with the ability to work effectively in a team environment
ADDITIONAL DESIRED SKILLS AND EXPERIENCE
- Experience with MEMS devices especially pressure sensors, accelerometers fabrication
- Knowledge of ISO 9001, ISO 13485 or TS 16949 quality systems
- Experience with Failure analysis
- Previous experience with New Product Introduction (NPI) is beneficial
- Experience with general wafer mapping formats such as Klarf, XML, and map conversion
- Experience with Pressure sensor Characterization and Application
- Knowledge of Manufacturing Execution System (MES) or SAP experience
COMPENSATION:
- Competitive base salary commensurate with experience: $112,800 – $169,300 year (subject to change dependent on physical location)
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits
